DSC6331ME2CA-048.0000T,6G模块晶振,CMOS石英晶体振荡器
频率:48MHz
尺寸:2.0×1.6mm
DSC6331ME2CA-048.0000T,6G模块晶振,CMOS石英晶体振荡器,Microchip晶振,DSC63XX有源晶振,DSC6331ME2CA-048.0000T晶振,2016mm超小型晶振,石英贴片晶振,欧美进口晶体,频率48MHz,电压3.3V,频率稳定性25ppm,工作温度-20~70°C,抗冲击晶振,抗振动晶振,无铅环保晶振,6G模块晶振,平板显示器晶振,多功能打印机晶振,数字标牌晶振,消费电子产品晶振.
DSC6331ME2CA-048.0000T,6G模块晶振,CMOS石英晶体振荡器,Microchip晶振,DSC63XX有源晶振,DSC6331ME2CA-048.0000T晶振,2016mm超小型晶振,石英贴片晶振,欧美进口晶体,频率48MHz,电压3.3V,频率稳定性25ppm,工作温度-20~70°C,抗冲击晶振,抗振动晶振,无铅环保晶振,6G模块晶振,平板显示器晶振,多功能打印机晶振,数字标牌晶振,消费电子产品晶振.
DSC6331ME2CA-048.0000T,6G模块晶振,CMOS石英晶体振荡器特点:
•输出频率:1MHz至100 MHz LVCMOS
•扩频选项:
-中心扩频:0.25%,0.5%,1.0%, 1.5%, 2.0%, 2.5%
-向下展频:–0.5%、–1.0%、–1.5%、–2.0%, –2.5%, –3.0%
•超小足迹
- 1.6 mm×1.2 mm
- 2.0 mm×1.6 mm
- 2.5 mm×2.0 mm
- 3.2 mm×2.5 mm
•超低功耗:3 mA(工作),12 mA(待机)
•宽电源电压范围:1.71v~3.63v VDD
•工业温度范围:- 40℃~ 85℃
-外商用:- 20°至70°C
•卓越的抗冲击和抗振动能力
•高可靠性
•无铅和符合RoHS标准
DSC6331ME2CA-048.0000T,6G模块晶振,CMOS石英晶体振荡器参数图
项目 | 规格说明 | 条件 |
额定频率 | 48MHz | 请联系我们以便获取其它可用频率的相关信息 |
电源电压 | 3.3V |
|
储存温度 | -55℃~+150℃ | 裸存 |
工作温度 | -20℃~ +70℃ |
|
频率稳定度 | ±25ppm | 所有温度范围 |
老化 |
±5ppm |
1 year @ +25°C |
电流 | 3.0mA Typ | FOUT = 27 MHz, VDD = 1.8V, No Load |
占空比 | 45%~55% |
|
输出逻辑电平低(Vol) |
0.2 x VDDV Max |
I=±3mA |
输出逻辑电平高(Voh) | 0.8 x VDDV Min | |
起始时间 | 1.3ms Max |
From 90% VDD to valid clock output, T = +25° C |
输出上升下降时间 | 2.0ns Max |
DSC63x1 Std. Drive, 20% to 80% CL = 10 pF |
Cycle-to-Cycle抖动(峰值) | 75ps Max | FOUT = 27 MHz |
周期抖动 |
14ps |
FOUT = 27 MHz RMS |
DSC6331ME2CA-048.0000T,6G模块晶振,CMOS石英晶体振荡器尺寸图
原厂代码 | 晶振品牌 | 型号 | 类型 | 频率 | 电压 | 尺寸 |
DSC557-0344SI1 | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) |
DSC1122DI2-200.0000 | Microchip Technology | DSC1122 | MEMS (Silicon) | 200MHz | 2.25 V ~ 3.6 V | 0.100" L x 0.079" W (2.54mm x 2.00mm) |
DSC6083HE1A-032K800T | Microchip Technology | DSC60XX | MEMS (Silicon) | 32.8kHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6083HE1A-032K800T | Microchip Technology | DSC60XX | MEMS (Silicon) | 32.8kHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6083HE1A-032K800T | Microchip Technology | DSC60XX | MEMS (Silicon) | 32.8kHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6011HI1A-002.5000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2.5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6011HI1A-002.5000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2.5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6011HI1A-002.5000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2.5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6013HI1A-002.5000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2.5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6013HI1A-002.5000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2.5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6013HI1A-002.5000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2.5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6083HI2A-002K000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2kHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6083HI2A-002K000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2kHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6083HI2A-002K000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2kHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6101MI2A-024.0000T | Microchip Technology | DSC6100 | MEMS (Silicon) | 24MHz | 1.71 V ~ 3.63 V | 0.079" L x 0.063" W (2.00mm x 1.60mm) |
DSC6101MI2A-024.0000T | Microchip Technology | DSC6100 | MEMS (Silicon) | 24MHz | 1.71 V ~ 3.63 V | 0.079" L x 0.063" W (2.00mm x 1.60mm) |
DSC6101MI2A-024.0000T | Microchip Technology | DSC6100 | MEMS (Silicon) | 24MHz | 1.71 V ~ 3.63 V | 0.079" L x 0.063" W (2.00mm x 1.60mm) |
DSC6001HI1A-005.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6001HI1A-005.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6001HI1A-005.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6003HI2A-048.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 48MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6003HI2A-048.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 48MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6003HI2A-048.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 48MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6003HI2A-012.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 12MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6003HI2A-012.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 12MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC6003HI2A-012.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 12MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) |
DSC1122DI2-200.0000T | Microchip Technology | DSC1122 | MEMS (Silicon) | 200MHz | 2.25 V ~ 3.6 V | 0.100" L x 0.079" W (2.54mm x 2.00mm) |
DSC557-0344SI1T | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) |
DSC557-0334SI0 | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) |
DSC557-0344SI0 | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) |
DSC557-0333SE1 | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) |
DSC557-0333SE1T | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) |
DSC557-0333SI1 | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) |
DSC557-0333SI1T | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) |
DSC557-0344SE1 | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) |
DSC557-0344SE1T | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) |
DSC557-0334SI0T | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) |
DSC557-0343SI1T | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) |
DSC557-0344SI0T | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) |
DSC557-0343SI1 | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) |
精工富士晶振-康华尔正规渠道指定供应商
服务热线:0755-27838351
手机联系:138-2330-0879
Q Q联系:632862232
邮 箱:konuaer@163.com
地 址:广东深圳市宝安区宝安大道东95号浙商大厦1905
采购:DSC6331ME2CA-048.0000T,6G模块晶振,CMOS石英晶体振荡器
- *联系人:
- *手机:
- 公司名称:
- 邮箱:
- *采购意向:
- *验证码:
跟此产品相关的产品 / Related Products
- DSC6001JI2A-125.0000T,6G以太网晶振,2520mm,低功耗晶振
DSC6001JI2A-125.0000T,6G以太网晶振,2520mm,低功耗晶振,美国晶振,Microchip石英贴片晶体,DSC60XX有源晶振,DSC6001JI2A-125.0000T晶振,2520mm晶振,超小型晶体振荡器,频率125MHz,电压3.3V,频率稳定性25ppm,工作温度-40~85°C,高可靠性晶振,无铅环保晶振,低功耗晶振,6G以太网晶振,物联网晶振,智能设备晶振,家庭医疗保健晶振,健身设备晶振,汽车信息娱乐系统晶振.
- ELLS-13.560MHz-10-R35-A4Y-F-T,AEL通讯晶振,SMD石英晶体谐振器
- ELLS-13.560MHz-10-R35-A4Y-F-T,AEL通讯晶振,SMD石英晶体谐振器,AEL晶振,艾尔晶振,英国进口晶振,型号:ELLS系列晶振,编码为:ELLS-13.560MHz-10-R35-A4Y-F-T,频率为:13.56MHz,负载电容:10pF,频率稳定性:±30ppm,频率容差:±30ppm,工作温度范围:-10℃至+60℃,小体积晶振尺寸:12.7x4.7x4.2mm封装,两脚贴片晶振,无源晶振,椭圆形石英晶振,石英晶体谐振器,SMD晶体,无铅环保晶振。具有小体积,轻薄型,高性能,高品质,高可靠性等特点。被广泛应用于:通讯设备晶振,汽车电子晶振,智能家居晶振,无线蓝牙晶振,物联网晶振,安防设备等应用。
- ABDFTCXO-24.576MHZ-L-2-T2,Abracon温补晶振,低电压晶振
- ABDFTCXO-24.576MHZ-L-2-T2,Abracon温补晶振,低电压晶振,美国进口晶振,Abracon晶振,艾博康晶振,型号:ABDFTCXO系列,编码为:ABDFTCXO-24.576MHZ-L-2-T2,频率:24.576MHz,电压:3.3V,频率稳定性:±280ppb,工作温度范围:-40℃至+85℃,LVCMOS输出TCXO温补晶振,小体积晶振尺寸:14.0x9.0x3.0mm封装,10垫脚贴片晶振,石英晶振,有源晶振,石英晶体振荡器。具有低抖动,低功耗,低耗能,低损耗,低电源电压,低电平等特点。应用程序:通信晶振,网络晶振,同步以太网晶振,IEEE1588,仪器晶振、测试和测量晶振,车载控制器晶振等应用。
精工晶振
富士晶振
雾化片
石英晶振
石英晶体振荡器
贴片晶振
32.768KHz晶振
欧美进口晶振
- KDS晶振
- 爱普生晶振
- NDK晶振
- 京瓷晶振
- 西铁城晶振
- 村田晶振
- 大河晶振
- CTS晶振
- 微晶晶振
- 瑞康晶振
- 康纳温菲尔德晶振
- 高利奇晶振
- Jauch晶振
- AbraconCrystal
- 维管晶振
- ECS晶振
- 日蚀晶振
- 拉隆晶振
- 格林雷晶振
- SiTime晶振
- IDT晶振
- Statek晶振
- Pletronics晶振
- ACT晶振
- MTI-Milliren晶振
- LiHom晶振
- 美国Rubyquartz晶振
- Oscilent晶振
- 日本纳卡晶振
- SHINSUNG晶振
- ITTI晶振
- SMI晶振
- PDI晶振
- C-TECH晶振
- NJR晶振
- IQD晶振
- Microchip晶振
- Silicon晶振
- Fortiming晶振
- CORE晶振
- NIPPON晶振
- NIC晶振
- QVS晶振
- Bomar晶振
- Bliley晶振
- GED晶振
- Filtronetics晶振
- STD晶振
- Q-Tech晶振
- Anderson晶振
- Wenzel晶振
- NEL晶振
- EM晶振
- PETERMANN晶振
- FCD-Tech晶振
- HEC晶振
- FMI晶振
- Macrobizes晶振
- AXTAL晶振
- SUNNY晶振
- ARGO晶振
- Skyworks晶振
- 瑞萨renesas晶振
谐振器/滤波器
数码电子产品
汽车电子产品
新增进口品牌
温补晶振
差分晶振
恒温晶振
咨询热线
0755-27838351
电话:0755-27838351
手机:138 2330 0879
QQ:632862232
邮箱: konuaer@163.com
地址:广东深圳市宝安区宝安大道东95号浙商大厦1905