DSC6331ME2CA-048.0000T,6G模块晶振,CMOS石英晶体振荡器
频率:48MHz
尺寸:2.0×1.6mm
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DSC6331ME2CA-048.0000T,6G模块晶振,CMOS石英晶体振荡器特点:
•输出频率:1MHz至100 MHz LVCMOS
•扩频选项:
-中心扩频:0.25%,0.5%,1.0%, 1.5%, 2.0%, 2.5%
-向下展频:–0.5%、–1.0%、–1.5%、–2.0%, –2.5%, –3.0%
•超小足迹
- 1.6 mm×1.2 mm
- 2.0 mm×1.6 mm
- 2.5 mm×2.0 mm
- 3.2 mm×2.5 mm
•超低功耗:3 mA(工作),12 mA(待机)
•宽电源电压范围:1.71v~3.63v VDD
•工业温度范围:- 40℃~ 85℃
-外商用:- 20°至70°C
•卓越的抗冲击和抗振动能力
•高可靠性
•无铅和符合RoHS标准
		
	
		
DSC6331ME2CA-048.0000T,6G模块晶振,CMOS石英晶体振荡器参数图
	
| 项目 | 规格说明 | 条件 | 
| 额定频率 | 48MHz | 请联系我们以便获取其它可用频率的相关信息 | 
| 电源电压 | 3.3V | 
						 | 
				
| 储存温度 | -55℃~+150℃ | 裸存 | 
| 工作温度 | -20℃~ +70℃ | 
						 | 
				
| 频率稳定度 | ±25ppm | 所有温度范围 | 
| 老化 | 
						±5ppm | 
					
						1 year @ +25°C | 
				
| 电流 | 3.0mA Typ | FOUT = 27 MHz, VDD = 1.8V, No Load | 
| 占空比 | 45%~55% | 
						 | 
				
| 输出逻辑电平低(Vol) | 
						 0.2 x VDDV Max  | 
					
						I=±3mA | 
				
| 输出逻辑电平高(Voh) | 0.8 x VDDV Min | |
| 起始时间 | 1.3ms Max | 
						From 90% VDD to valid clock output, T = +25° C | 
				
| 输出上升下降时间 | 2.0ns Max | 
						DSC63x1 Std. Drive, 20% to 80% CL = 10 pF | 
				
| Cycle-to-Cycle抖动(峰值) | 75ps Max | FOUT = 27 MHz | 
| 
						周期抖动 | 
					14ps | 
						FOUT = 27 MHz RMS | 
				
		
	
		
 
	
DSC6331ME2CA-048.0000T,6G模块晶振,CMOS石英晶体振荡器尺寸图
| 原厂代码 | 晶振品牌 | 型号 | 类型 | 频率 | 电压 | 尺寸 | 
| DSC557-0344SI1 | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 
| DSC1122DI2-200.0000 | Microchip Technology | DSC1122 | MEMS (Silicon) | 200MHz | 2.25 V ~ 3.6 V | 0.100" L x 0.079" W (2.54mm x 2.00mm) | 
| DSC6083HE1A-032K800T | Microchip Technology | DSC60XX | MEMS (Silicon) | 32.8kHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6083HE1A-032K800T | Microchip Technology | DSC60XX | MEMS (Silicon) | 32.8kHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6083HE1A-032K800T | Microchip Technology | DSC60XX | MEMS (Silicon) | 32.8kHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6011HI1A-002.5000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2.5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6011HI1A-002.5000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2.5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6011HI1A-002.5000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2.5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6013HI1A-002.5000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2.5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6013HI1A-002.5000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2.5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6013HI1A-002.5000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2.5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6083HI2A-002K000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2kHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6083HI2A-002K000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2kHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6083HI2A-002K000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 2kHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6101MI2A-024.0000T | Microchip Technology | DSC6100 | MEMS (Silicon) | 24MHz | 1.71 V ~ 3.63 V | 0.079" L x 0.063" W (2.00mm x 1.60mm) | 
| DSC6101MI2A-024.0000T | Microchip Technology | DSC6100 | MEMS (Silicon) | 24MHz | 1.71 V ~ 3.63 V | 0.079" L x 0.063" W (2.00mm x 1.60mm) | 
| DSC6101MI2A-024.0000T | Microchip Technology | DSC6100 | MEMS (Silicon) | 24MHz | 1.71 V ~ 3.63 V | 0.079" L x 0.063" W (2.00mm x 1.60mm) | 
| DSC6001HI1A-005.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6001HI1A-005.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6001HI1A-005.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 5MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6003HI2A-048.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 48MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6003HI2A-048.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 48MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6003HI2A-048.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 48MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6003HI2A-012.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 12MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6003HI2A-012.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 12MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC6003HI2A-012.0000T | Microchip Technology | DSC60XX | MEMS (Silicon) | 12MHz | 1.71 V ~ 3.63 V | 0.063" L x 0.047" W (1.60mm x 1.20mm) | 
| DSC1122DI2-200.0000T | Microchip Technology | DSC1122 | MEMS (Silicon) | 200MHz | 2.25 V ~ 3.6 V | 0.100" L x 0.079" W (2.54mm x 2.00mm) | 
| DSC557-0344SI1T | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 
| DSC557-0334SI0 | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 
| DSC557-0344SI0 | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 
| DSC557-0333SE1 | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 
| DSC557-0333SE1T | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 
| DSC557-0333SI1 | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 
| DSC557-0333SI1T | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 
| DSC557-0344SE1 | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 
| DSC557-0344SE1T | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 
| DSC557-0334SI0T | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 
| DSC557-0343SI1T | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 
| DSC557-0344SI0T | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 
| DSC557-0343SI1 | Microchip Technology | DSC557-03 | MEMS (Silicon) | 100MHz | 2.25 V ~ 3.6 V | 0.197" L x 0.177" W (5.00mm x 4.50mm) | 
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